Touch sensor and display device including the same

ABSTRACT

A touch sensor includes a substrate, an insulating layer, a sensor, and sensing lines. The substrate includes: a sensing region, and a peripheral region at a periphery of the sensing region. The insulating layer is on the substrate. The insulating layer includes contact holes. The sensor is on the substrate and overlaps the sensing region. The sensing lines are on the substrate and overlap the peripheral region. The sensing lines are connected to the sensor. Each of the sensing lines is formed as a multilayer structure. The multilayer structure includes a first electrically conductive layer on the substrate, and a second electrically conductive layer connected to the first electrically conductive layer via a contact hole among the contact holes. Widths of the sensing lines are different from one another.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2016-0179510, filed Dec. 26, 2016, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

The disclosure generally relates to a touch sensor and a display deviceincluding the same.

Discussion

A touch sensor is an input device that enables a command of a user to beinput by selecting an instruction associated with content displayed on ascreen of a display device or the like with an input tool, e.g., a handof the user, an object, a stylus, etc. In general, the touch sensor mayinclude touch electrodes, sensing lines connected to the touchelectrodes, and a pad unit connected to the sensing lines so that atouch event generated in a sensing region can be recognized as an inputsignal.

Meanwhile, in the touch sensor, the sensing lines may have differentline lengths depending on positions of the touch electrodes. Inparticular, when the sensing lines have the same line width, adifference in line resistance between sensing lines may occur due todifferent line lengths. As the difference in line resistance between thesensing lines increases and distorts a signal for sensing the touchevent, the difference in line resistance between the sensing lines mayact as a factor that disturbs accurate detection of a touch event.

The above information disclosed in this section is only forunderstanding the background of the inventive concepts, and, therefore,may contain information that does not form prior art.

SUMMARY

Some exemplary embodiments are capable of providing a touch sensorhaving a uniform touch recognition rate.

Some exemplary embodiments are capable of providing a display deviceincluding a touch sensor having a uniform touch recognition rate.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concepts.

According to some exemplary embodiments, a touch sensor includes asubstrate, an insulating layer, a sensor, and sensing lines. Thesubstrate includes a sensing region, and a peripheral region at aperiphery of the sensing region. The insulating layer is on thesubstrate. The insulating layer includes contact holes. The sensor is onthe substrate and overlaps the sensing region. The sensing lines are onthe substrate and overlap the peripheral region. The sensing lines areconnected to the sensor. Each of the sensing lines is formed as amultilayer structure. The multilayer structure includes a firstelectrically conductive layer on the substrate, and a secondelectrically conductive layer connected to the first electricallyconductive layer via a contact hole among the contact holes. Widths ofthe sensing lines are different from one another.

According to some exemplary embodiments, a display device includes afirst base substrate, a thin film transistor, a light emitting device,and a touch sensor. The first base substrate includes a display region,and a non-display region at the periphery of the display region. Thethin film transistor is on the first base substrate and overlaps thedisplay region. The light emitting device is connected to the thin filmtransistor. The touch sensor is on a surface of the first basesubstrate. The touch sensor is configured to sense a position of a touchinteraction. The touch sensor includes a second base substrate, aninsulating layer, a sensor, and sensing lines. The second base substrateincludes a sensing region corresponding to the display region, and aperipheral region at a periphery of the sensing region. The insulatinglayer is on the second base substrate. The insulating layer includescontact holes. The sensor is on the second base substrate and overlapsthe sensing region. The sensing lines are on the second base substrateand overlap the peripheral region. The sensing lines are connected tothe sensor. Each of the sensing lines is formed as a multilayerstructure. The multilayer structure includes a first electricallyconductive layer on the second base substrate, and a second electricallyconductive layer connected to the first electrically conductive layervia a contact hole among the contact holes. Widths of the sensing linesare different from one another.

According to some exemplary embodiments, a touch sensor includes asubstrate, a sensor, and sensing lines. The substrate includes a sensingregion, and a peripheral region outside the sensing region. The sensoris on a surface of the substrate and overlaps the sensing region. Thesensing lines are on the surface of the substrate and overlap theperipheral region. The sensing lines are connected to the sensor. Eachof the sensing lines is formed as a multilayer structure. In a directionnormal to the surface, a width of each multilayer structure variesbetween a first width and a second width different from the first width.First widths of the sensing lines are different from one another.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1 is a perspective view illustrating a display device according tosome exemplary embodiments.

FIG. 2 is a plan view illustrating a display panel of the display deviceof FIG. 1 according to some exemplary embodiments.

FIG. 3 is a plan view illustrating a touch sensor of the display deviceof FIG. 1 according to some exemplary embodiments.

FIG. 4 is a sectional view taken along sectional line I-I′ of FIG. 1according to some exemplary embodiments.

FIG. 5 is an enlarged plan view of portion E1 of the touch sensor ofFIG. 3 according to some exemplary embodiments.

FIG. 6 is a sectional view taken along sectional lines II-II′ andIII-III′ of FIG. 5 according to some exemplary embodiments.

FIG. 7 is a graph comparing line widths and resistances of first sensinglines according to some exemplary embodiments.

FIG. 8 is an enlarged plan view of portion E2 of the touch sensor ofFIG. 3 according to some exemplary embodiments.

FIG. 9 is a sectional view taken along sectional lines IV-IV′ and V-V′of FIG. 8 according to some exemplary embodiments.

FIG. 10 is an enlarged plan view of portion E3 of the touch sensor ofFIG. 3 according to some exemplary embodiments.

FIG. 11 is a sectional view taken along sectional line VI-VI′ of FIG. 10according to some exemplary embodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments. Further, various exemplary embodiments may be different,but do not have to be exclusive. For example, specific shapes,configurations, and characteristics of an exemplary embodiment may beimplemented in another exemplary embodiment without departing from thespirit and the scope of the disclosure.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someexemplary embodiments. Therefore, unless otherwise specified, thefeatures, components, modules, layers, films, panels, regions, aspects,etc. (hereinafter individually or collectively referred to as“elements”), of the various illustrations may be otherwise combined,separated, interchanged, and/or rearranged without departing from thespirit and the scope of the disclosure.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element is referred to as being “on,” “connected to,” or“coupled to” another element, it may be directly on, connected to, orcoupled to the other element or intervening elements may be present.When, however, an element is referred to as being “directly on,”“directly connected to,” or “directly coupled to” another element, thereare no intervening elements present. To this end, the term “connected”may refer to physical, electrical, and/or fluid connection. Further, theD1-axis, the D2-axis, and the D3-axis are not limited to three axes of arectangular coordinate system, and may be interpreted in a broadersense. For example, the D1-axis, the D2-axis, and the D3-axis may beperpendicular to one another, or may represent different directions thatare not perpendicular to one another. For the purposes of thisdisclosure, “at least one of X, Y, and Z” and “at least one selectedfrom the group consisting of X, Y, and Z” may be construed as X only, Yonly, Z only, or any combination of two or more of X, Y, and Z, such as,for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, these elements should not be limited by theseterms. These terms are used to distinguish one element from anotherelement. Thus, a first element discussed below could be termed a secondelement without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one element's relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. In this manner, regions illustrated in the drawings areschematic in nature and shapes of these regions may not illustrate theactual shapes of regions of a device, and, as such, are not intended tobe limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a perspective view illustrating a display device according tosome exemplary embodiments. FIG. 2 is a plan view illustrating a displaypanel of the display device of FIG. 1 according to some exemplaryembodiments. FIG. 3 is a plan view illustrating a touch sensor of thedisplay device of FIG. 1 according to some exemplary embodiments.

Referring to FIGS. 1 to 3, a display device may be provided in variousshapes. For example, the display device may be provided in aquadrangular plate shape having two pairs of sides parallel to eachother. When the display device is provided in the rectangular plateshape, any one pair of sides among the two pairs of sides may beprovided longer than the other pair of sides. For illustrative anddescriptive convenience, a case where the display device has a pair oflong sides and a pair of short sides is provided. In this case, theextending direction of the short side is represented as a firstdirection DR1, the extending direction of the long side is representedas a second direction DR2, and the extending direction of a thickness isrepresented as a third direction DR3.

The display device may include a display panel 100 provided with displayelements (not shown) that display an image, and a touch sensor 200 thatrecognizes a touch.

The display device may include a display region DA in which an imagegenerated via the display panel 100 is displayed, a non-display regionNDA provided at, at least one side of the display region DA, a sensingregion SA in which a touch interaction of a user on or near the touchsensor 200 and/or a pressure of the touch interaction is sensed, and aperipheral region PA provided at, at least one side of the sensingregion SA. The sensing region SA may overlap with the display region DA.The sensing region SA may have an area substantially equal to or largerthan that of the display region DA. For convenience, the sensing regionSA will be described as corresponding to the display region DA. A touchinteraction may include actual contact with the display device inassociation with the sensing region SA, a hovering interaction over thesensing region SA, an approach of a touch interaction with the sensingregion SA, and/or the like. For descriptive convenience, a touchinteraction will generally be referred to as a touch.

The display panel 100 may display arbitrary visual information, e.g., atext, a video, a picture, a two-dimensional or three-dimensional image,etc. Hereinafter, the arbitrary visual information is referred to as an“image,” however, the kind of the display panel 100 is not limited toones that display images.

The display panel 100 may include a first base substrate BS1 includingthe display region DA and the non-display region NDA. Here, the displayregion DA is located at a central portion of the display panel 100, andmay have a relatively large area as compared with the non-display regionNDA. The display region DA may have various shapes. For example, thedisplay region DA may be provided in various shapes, such as aclosed-shape polygon including linear sides, a circle, an ellipse, etc.,including curved sides, and a semicircle, a semi-ellipse, etc.,including linear and curved sides. In this manner, the display region DAmay include polygonal and/or free-form (or irregular) shapes (orcontours). When the display region DA includes a plurality of regions,each region may also be provided in various shapes, such as aclosed-shape polygon including linear sides, a circle, an ellipse, etc.,including curved sides, and a semicircle, a semi-ellipse, etc.,including linear and curved sides. In addition, areas of the pluralityof regions may be equal to or different from one another. Forconvenience, a case where the display region DA is provided as oneregion having a quadrangular shape including linear sides is describedand illustrated as an example.

The non-display region NDA may be provided at, at least one side of thedisplay region DA. In some exemplary embodiments, the non-display regionNDA may surround the circumference of the display region DA. In anexemplary embodiment, the non-display region NDA may include a lateralpart extending in the first direction DR1 and a longitudinal partextending in the second direction DR2. The longitudinal part of thenon-display region NDA may be provided as a pair of longitudinal partsspaced apart from each other along, for instance, the width direction ofthe display region DA.

The display region DA may include a plurality of pixel regions in whicha plurality of pixels PXL are provided. As will become more apparentbelow, a pad unit (or area) provided with pads of lines and a datadriver DDV that provides a data signal to the pixels PXL are provided inthe non-display region NDA. The data driver DDV may provide the datasignal to the respective pixels PXL through data lines (not shown).Here, the data driver DDV may be disposed at a lateral part of thenon-display region NDA, and extend long along the width direction of thenon-display region NDA. For convenience, a scan driver, an emissiondriver, and a timing controller are not illustrated in FIG. 2, but thetiming controller, the emission driver, and the scan driver may also beprovided in the non-display region NDA or may be connected to thenon-display region NDA.

The first base substrate SB1 may be made of various materials, e.g.,glass, polymer, metal, and/or the like. For instance, the first basesubstrate BS1 may be an insulative substrate made of a polymer organicmaterial. The material of the insulative substrate including the polymerorganic material, may include at least one of polystyrene, polyvinylalcohol, polymethyl methacrylate, polyethersulfone, polyacrylate,polyetherimide, polyethylene naphthalate, polyethylene terephthalate,polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetatecellulose, and cellulose acetate propionate. However, the materialconstituting the first base substrate BS1 is not limited thereto orthereby. For example, the first base substrate BS1 may be made of afiber reinforced plastic (FRP), carbon nanotubes, etc. To this end, thefirst base substrate BS1 may have a singular or multilayerconfiguration. In a multilayer configuration, some layers of the firstbase substrate BS1 may be different than other layers of the first basesubstrate BS1.

The first base substrate BS1 may include a plurality of signal lines(not shown) connected to the plurality of pixels PXL and a plurality ofthin film transistors (not shown) connected to the plurality of signallines. For instance, the signal lines may form data lines, scan lines,emission lines, etc.

As will become more apparent below, each of the plurality of pixels PXLmay be an organic light emitting device including an organic layer.However, exemplary embodiments are not limited thereto or thereby, andeach of the plurality of pixels PXL may be implemented in various forms,such as a liquid crystal device, an electrophoretic device, anelectrowetting device, etc. The plurality of pixels PXL may be providedin (or overlapping) the display region DA of the first base substrateBS1. Each pixel PXL may be considered a minimum unit that displays animage, and may be provided in plurality. The pixel PXL may include anorganic light emitting device that emits white light and/or coloredlight. The pixel PXL may emit light of any one color among red, green,and blue; however, exemplary embodiments are not limited thereto orthereby. For instance, the pixel PXL may emit light of any one coloramong cyan, magenta, yellow, and the like. It is also contemplated thatthe pixel PXL may be configured to emit light of different colors. Thepixel PXL may include a thin film transistor (not shown) connected tothe plurality of signal lines (not shown), and the organic lightemitting device connected to the thin film transistor. The pixel PXL,the plurality of signal lines, and the plurality of thin filmtransistors will be described later.

The touch sensor 200 may be provided on a surface on which an image ofthe display panel 100 is displayed. In some exemplary embodiments, thetouch sensor 200 may be integrally provided with the display panel 100,e.g., inside the display panel 100. For convenience, a case where thetouch sensor 200 is provided on a surface (e.g., top surface) of thedisplay panel 100 is described and illustrated. The top surface may beconsidered a surface furthest away from the first base substrate BS1.

The touch sensor 200 may include a second base substrate BS2 includingthe sensing region SA and the peripheral region PA.

The second base substrate BS2 may be made of an insulative materialhaving flexibility. Here, the second base substrate BS2 may be providedin a shape substantially identical to that of the first base substrateBS1, but exemplary embodiments are not limited thereto or thereby. Forinstance, the second base substrate BS2 may have an area equal to orlarger than that of the first base substrate BS1.

The sensing region SA corresponds to the display region DA of thedisplay panel 100, and may be provided in a shape identical to that ofthe display region DA, but exemplary embodiments are not limited theretoor thereby. The peripheral region PA may be disposed adjacent to thesensing region SA. Also, the peripheral region PA may correspond to thenon-display region NDA of the display panel 100, and may include atleast one lateral part and at least one longitudinal part.

The touch sensor 200 may include a touch sensing unit (or touch sensor)provided in the sensing region SA, a line unit (or lines) provided inthe peripheral region PA, and a touch sensor pad unit (or touch sensorpads) connected to the line unit.

The touch sensing unit may recognize a touch event with the displaydevice through a hand of a user or a separate input means, e.g., stylus,etc. In some exemplary embodiments, the touch sensing unit may be drivenaccording to a mutual capacitance method. In the mutual capacitancemethod, a change in capacitance, caused by an interaction between twosensing electrodes, is sensed. In some exemplary embodiments, the touchsensing unit may be driven according to a self-capacitance method. Inthe self-capacitance method, when a user touches a region, a change incapacitance of a sensing electrode in the touched region is sensed usingsensing electrodes arranged in a matrix shape and sensing linesconnected to the respective sensing electrodes.

The touch sensing unit may include a touch sensor SR provided in thesensing region SA, sensing lines SL connected to the touch sensor SR,and a touch sensor pad unit TP connected to end portions of the sensinglines SL.

When a touch of a user is applied to (or with respect to) the displaydevice, the touch sensor SR is used to sense the touch of the userand/or a pressure of the touch, and may be provided in the sensingregion SA. When viewed on a plane, e.g., in a view normal to a surfaceof the second base substrate BS2, the touch sensor SR may correspond tothe display region DA.

The touch sensor SR may include a plurality of first sensing units SR1that extend in the first direction DR1 of the second base substrate BS2and is applied with a sensing voltage, and a plurality of second sensingunits SR2 that extend in the second direction DR2 intersecting the firstdirection DR1. The first sensing units SR1 may be capacitively coupledto the second sensing units SR2, and the voltage of the first sensingunits SR1 may be changed by the capacitive coupling.

Each first sensing unit SR1 may include a plurality of first sensingelectrodes SSE1 arranged in the first direction DR1 and a plurality offirst bridges BR1 through which adjacent first sensing electrodes SSE1are connected to each other. The first sensing electrodes SSE1 may beprovided in various shapes, e.g., a bar shape, a polygonal shapeincluding a quadrangular shape, such as a diamond, etc. In someexemplary embodiments, the first sensing electrodes SSE1 and the firstbridges BR1 may be provided as a whole plate shape or may be provided inthe shape of a mesh including fine lines.

Each second sensing unit SR2 may include a plurality of second sensingelectrodes SSE2 arranged in the second direction DR2 and a plurality ofsecond bridges BR2 through which adjacent second sensing electrodes SSE2are connected to each other. The second sensing electrodes SSE2 may beprovided in various shapes, e.g., a bar shape, a polygonal shapeincluding a quadrangular shape, such as a diamond, etc. In someexemplary embodiments, the second sensing electrodes SSE2 and the secondbridges BR2 may be provided as a whole plate shape or may be provided inthe shape of a mesh including fine lines.

The first sensing electrodes SSE1 and the second sensing electrodes SSE2may be alternately arranged in a matrix form on the second basesubstrate SB2.

The first sensing electrodes SSE1 and the second sensing electrodes SSE2may be insulated from each other. For instance, as seen in FIG. 3, thefirst bridges BR1 and the second bridges BR2 intersect each other;however, the first bridges BR1 and the second bridges BR2 may beinsulated from each other with an insulating layer (not shown)interposed therebetween, as will become more apparent below. The firstsensing unit SR1 and the second sensing unit SR2 may be provided ondifferent layers, but exemplary embodiments are not limited thereto orthereby. In some exemplary embodiments, the first sensing electrodesSSE1 and the second sensing electrodes SSE2 may be provided on the samelayer, and the first bridges BR1 and the second bridges BR2 may beprovided on different layers.

The sensing lines SL are used to connect the touch sensor SR to a driver(not shown) that drives the touch sensor SR, and may be provided in theperipheral region PA. The driver may be provided on the first basesubstrate BS1 of the display panel 100 or be provided at the outside,e.g., on a separate printed circuit board or the like. The driver mayinclude a position detection circuit. The sensing lines SL may transmita sensing input signal from the driver to the first sensing units SR1and the second sensing units SR2, or transmit sensing output signalsfrom the first sensing units SR1 and the second sensing units SR2 to thedriver.

In some exemplary embodiments, the sensing lines SL may include aplurality of first sensing lines SL1 and a plurality of second sensinglines SL2.

The first sensing lines SL1 may be connected to the first sensing unitsSR1. Each first sensing line SL1 may be connected to a corresponding rowof the first sensing units SR1. When viewed on a plane, the firstsensing lines SL1 may be bent plural times in the peripheral region PA,and extend along the second direction DR2. As seen in FIG. 3, the firstsensing lines SL1 may be provided in a right longitudinal part of theperipheral region PA to be connected to corresponding rows of the firstsensing units SR1. In some exemplary embodiments, the first sensinglines SL1 may be provided in a left longitudinal part of the peripheralregion PA and/or the right longitudinal part of the peripheral region.

The second sensing lines SL2 may be connected to the second sensingunits SR2. Each second sensing line SL2 may be connected to acorresponding column of the second sensing units SR2. When viewed on aplane, the second sensing lines SL2 may be bent plural times in theperipheral region PA, and extend along the first direction DR1. As seenin FIG. 3, the second sensing lines SL2 may be provided in a lowerlateral part of the peripheral region PA to be connected tocorresponding columns of the second sensing units SR2. In some exemplaryembodiments, the second sensing lines SL2 may be provided in an upperlateral part of the peripheral region PA and/or the lower lateral partof the peripheral region PA.

The touch sensor pad unit TP may be a component provided to transmit asignal to the driver between the touch sensor SR and the driver or totransmit a signal to the touch sensor SR. The touch sensor pad unit TPis provided in the peripheral region PA, and may be connected to endportions of the sensing lines SL. The touch sensor pad unit TP may beconnected to pad units (not shown) of the display panel 100 through aconductive member (not shown), etc.

In some exemplary embodiments, the touch sensor pad unit TP may includea first touch sensor pad unit TP1 connected to end portions of the firstsensing lines SL1 and a second touch sensor pad unit TP2 connected toend portions of the second sensing lines SL2. When viewed on a plane,the first touch sensor pad unit TP1 and the second touch sensor pad unitTP2 may be provided in the peripheral region PA to be adjacent to eachother and be spaced apart from each other at a certain distance. In someexemplary embodiments, the first touch sensor pad unit TP1 and thesecond touch sensor pad unit TP2 may be provided in the peripheralregion PA to be spaced apart from each other, but exemplary embodimentsare not limited thereto or thereby. For example, the first touch sensorpad unit TP1 and the second touch sensor pad unit TP2 may be implementedas one touch sensor pad unit in the peripheral region PA.

According to some exemplary embodiments, the touch sensor SR, thesensing lines SL, and the touch sensor pad unit TP may be made of aconductive material. The conductive material may include at least one ofa metal, any alloy thereof, a conductive polymer, a conductive metaloxide, a nano-conductive material, and the like. In some exemplaryembodiments, examples of the metal may be copper, silver, gold,platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium,iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium,tantalum, titanium, bismuth, antimony, lead, and the like. Examples ofthe conductive polymer may be polythiophene-based, polypyrrole-based,polyaniline-based, polyacetylene-based, and polyphenylene-basedcompounds, mixtures thereof, and the like. In particular, a PEDOT/PSScompound among the polythiophene-based compounds may be used as theconductive polymer. Examples of the conductive metal oxide may be indiumtin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO),indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), andthe like. In addition, examples of the nano-conductive compound may besilver nanowire (AgNW), carbon nano tube (CNT), graphene, and the like.

FIG. 4 is a sectional view taken along sectional line I-I′ of FIG. 1according to some exemplary embodiments.

Referring to FIGS. 1 and 4, the display device may include a displaypanel 100 and a touch sensor 200. The display panel 100 may include afirst base substrate BS1, a thin film transistor TFT provided on thefirst base substrate BS1, and a light emitting device OLED connected tothe thin film transistor TFT. The touch sensor 200 may include a secondbase substrate BS2, and a sensing line SL, and a touch sensor SR, whichare provided on the second base substrate BS2. Hereinafter, the displaydevice will be described according to a stacking order of the variouselements. For convenience, the display panel 100 will be firstdescribed, and the touch sensor 200 will be then described.

The first base substrate BS1 may include a display region DA and anon-display region NDA provided at a side of the display region DA.Here, the thin film transistor TFT and the light emitting device OLEDmay be provided in (e.g., overlapping) the display region DA, and apower line PL may be provided in the non-display region NDA. Forconvenience, the display region DA will be first described.

A buffer layer BFL may be provided on the first base substrate BS1. Thebuffer layer BFL may prevent impurities from being diffused into thethin film transistor TFT provided on the first base substrate BS1, andimprove the flatness of the first base substrate BS1. The buffer layerBFL may be provided as a single layer, but may be formed as amulti-layer structure including at least two layers. The buffer layerBFL may be an inorganic insulating layer made of an inorganic material.For example, the buffer layer BFL may be formed of silicon nitride,silicon oxide, silicon oxynitride, or the like. When the buffer layerBFL is provided as the multi-layer structure, the layers may be formedof the same material or different materials. The buffer layer BFL may beomitted.

An active pattern ACT may be provided on the buffer layer BFL. Theactive pattern ACT may be formed of a semiconductor material. The activepattern ACT may include a source region, a drain region, and a channelregion provided between the source region and the drain region. Theactive pattern ACT may be a semiconductor pattern made of poly-silicon,amorphous silicon, semiconductor oxide, or the like. The channel regionis a semiconductor pattern undoped with impurities, and may be anintrinsic semiconductor. The source region and the drain region may besemiconductor patterns doped with impurities.

A gate insulating layer GI is disposed on the buffer layer BFL havingthe active pattern ACT provided thereon. The gate insulating layer GImay be an inorganic insulating layer including an inorganic material.Alternatively, the gate insulating layer GI may be an organic insulatinglayer including an organic material.

A gate electrode GE may be provided on the gate insulating layer GI. Thegate electrode GE may be formed to cover (or overlap) a regioncorresponding to the channel region of the active pattern ACT. The gateelectrode GE may be made of a metal. For example, the gate electrode GEmay be made of at least one of metals, such as gold (Au), silver (Ag),aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel(Ni), neodymium (Nd), and copper (Cu), or alloys thereof. In addition,the gate electrode GE may be formed in a single layer, but exemplaryembodiments are not limited thereto or thereby. For example, the gateelectrode GE may be formed as a multi-layer structure in which two ormore materials among the metals and the alloys are stacked. In someexemplary embodiments, although not shown in the drawings, a gate linethat provides a scan signal to the thin film transistor TFT may beprovided in the same layer as the gate electrode GE and include the samematerial.

An interlayer insulating layer ILD is provided on the gate insulatinglayer GI having the gate electrode GE provided thereon. The interlayerinsulating layer ILD may be an inorganic insulating layer including aninorganic material. The inorganic material may include polysiloxane,silicon nitride, silicon oxide, silicon oxynitride, and the like.

A source electrode SE and a drain electrode DE may be provided on theinterlayer insulating layer ILD. The source electrode SE and the drainelectrode DE may be connected to the source region and the drain regionof the active pattern ACT through contact holes sequentially passingthrough the interlayer insulating layer ILD and the gate insulatinglayer GI, respectively. The source electrode SE and the drain electrodeDE may be made of a metal. For example, the source electrode SE and thedrain electrode DE may be made of at least one of metals such as gold(Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr),titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloysthereof. In addition, the source electrode SE and the drain electrode DEmay be formed in a single layer, but exemplary embodiments are notlimited thereto or thereby. For example, the source electrode SE and thedrain electrode DE may be formed as a multi-layer structure in which twoor more materials among the metals and the alloys are stacked.

In some exemplary embodiments, the thin film transistor TFT may includethe active pattern ACT, the gate electrode GE, the source electrode SE,and the drain electrode DE. A case where the thin film transistor TFT isa thin film transistor having a top gate structure is illustrated as anexample, but exemplary embodiments are not limited thereto or thereby.For example, the thin film transistor TFT may be a thin film transistorhaving a bottom gate structure, a dual gate structure, etc.

A protective layer PSV that covers the thin film transistor TFT may beprovided on the interlayer insulating layer ILD on which the sourceelectrode SE and the drain electrode DE are provided. The protectivelayer PSV may be an organic insulating layer including an organicmaterial. Examples of the organic material may be organic insulatingmaterials including a polyacryl-based compound, a polyimide-basedcompound, a fluorine-based compound, such as Teflon, abenzocyclobutene-based compound, and the like.

The light emitting device OLED may be provided on the protective layerPSV. The light emitting device OLED may include a first electrode AD, anemitting layer EML provided on the first electrode AD, and a secondelectrode CD provided on the emitting layer EML. The first electrode ADis provided on the protective layer PSV, and may be connected to thedrain electrode DE through a contact hole passing through the protectivelayer PSV.

A pixel defining layer PDL may be provided on the first electrode AD.The pixel defining layer PDL may allow a region corresponding to a lightemitting region of each pixel (see, e.g., PXL of FIG. 2) to be exposedtherethrough. For example, the pixel defining layer PDL may allow a topsurface of the first electrode AD to be exposed therethrough, andprotrude from the protective layer PSV along the circumference of eachpixel PXL.

The emitting layer EML may be provided on the first electrode AD exposedby the pixel defining layer PDL. The second electrode CD may be providedon the emitting layer EML. The first electrode AD may be an anodeelectrode and the second electrode CD may be a cathode electrode. Inaddition, when the light emitting device OLED is a top-emission lightemitting device, the first electrode AD may be a reflective electrode,and the second electrode CD may be a transmissive electrode.

As described above, when the first electrode AD is the anode electrodeand the reflective electrode, the first electrode AD may include areflective layer (not shown) and a transparent conductive layer (notshown) disposed on the top or bottom of the reflective layer. At leastone of the transparent conductive layer and the reflective layer may beconnected to the drain electrode DE.

The pixel defining layer PDL may include an organic insulating material.For example, the pixel defining layer PDL may include at least one ofpolystyrene, polymethylmethacrylate (PMMA), polyacrylonitrile (PAN),polyamide (PA), polyimide (PI), polyarylether (PAE), heterocyclicpolymer, parylene, epoxy, benzocyclobutene (BCB), a siloxane basedresin, and a silane based resin.

The emitting layer EML may have a multi-layered thin film structureincluding a light generation layer that generates colored light or whitelight. The second electrode CD may be provided on the emitting layerEML. The second electrode CD may extend from display region DA to apartial region of the non-display region NDA.

An encapsulation layer SLM may be provided over the second electrode CD.The encapsulation layer SLM may prevent (or reduce) oxygen and moisturefrom penetrating into the light emitting device OLED.

The non-display region NDA of the first base substrate BS1 will now bedescribed according to a stacking order.

The buffer layer BFL, the gate insulating layer GI, and the interlayerinsulating layer ILD may be sequentially provided on the first basesubstrate BS1. The power line PL for driving the thin film transistorTFT and the light emitting device OLED may be provided on the interlayerinsulating layer ILD. The protective layer PSV may be provided over thepower line PL. A connection line CNL may be provided on the protectivelayer PSV. The connection line CNL may be connected to the power line PLthrough a contact hole passing through the protective layer PSV. Thepixel defining layer PDL may be provided on the connection line CNL. Inaddition, the encapsulation layer SLM may be provided over (e.g.,covering) the pixel defining layer PDL.

Hereinafter, the touch sensor 200 will be described according to astacking order.

The second base substrate BS2 including a sensing region SA and aperipheral region PA may be provided on the encapsulation layer SLM.

The touch sensor SR and the sensing line SL may be provided on thesecond base substrate BS2. The touch sensor SR may be provided in (e.g.,overlapping) the sensing region SA of the second base substrate BS2, andthe sensing line SL may be provided in the peripheral region PA of thesecond base substrate BS2. The sensing line SL may be provided on theperipheral region PA to correspond to a portion of the second electrodeCD of the light emitting device OLED. For example, the sensing line SLmay be disposed on the second electrode CD to cover a portion of thesecond electrode CD, and, thereby, overlap with a portion of the secondelectrode CD.

An insulating layer IL may be provided over the touch sensor SR and thesensing line SL. The insulating layer IL may function to protect thetouch sensor SR and the sensing line SL from the outside.

In some exemplary embodiments, the portion of the second electrode CD,which overlaps with the sensing line SL, may be an interferenceprevention layer that prevents (or reduces) voltages applied to thedisplay panel 100 from interfering with sensing inputs and/or outputsignals, applied to the sensing line SL. The sensing inputs and/or theoutput signals, applied to the sensing line SL, may be signals forsensing a touch event in the sensing region SA.

In some cases, the sensing inputs and/or the output signals, applied tothe sensing line SL, may be distorted while including noise due toinfluence of voltages applied to the display panel 100, e.g., a datasignal, a scan signal, an emission control signal, first and seconddriving voltages, and the like, to be provided to the touch sensor SR.In these cases, it may be difficult for the touch sensor 200 to detectan accurate touch event. According to some exemplary embodiments,however, the sensing line SL may be disposed in the peripheral region PAto overlap with a portion of the second electrode CD when viewed on aplane, so that the interference caused by the voltages applied to thedisplay device 100 can be blocked by the second electrode CD. In thismanner, the sensing inputs and/or the output signals, applied to thesensing line SL, are not distorted.

FIG. 5 is an enlarged plan view of portion El of the touch sensor ofFIG. 3 according to some exemplary embodiments. FIG. 6 is a sectionalview taken along sectional lines II-II′ and III-III′ of FIG. 5 accordingto some exemplary embodiments.

Referring to FIGS. 3, 5, and 6, first sensing lines SL1 may be providedin the peripheral region PA of the second base substrate BS2, and extendtoward the first touch sensor pad unit TP1 along the second directionDR2 of the second base substrate BS2 from first sensing electrodes SSE1.

The first sensing lines SL1 may include (1-1)th to (1-8)th sensing linesSL1_1, SL1_2, SL1_3, SL1_4, SL1_5, SL1_6, SL1_7, and SL1_8. Line widthsof the (1-1)th to (1-8)th sensing lines SL1_1, SL1_2, SL1_3, SL1_4,SL1_5, SL1_6, SL1_7, and SL1_8 may be different from one another. Forexample, the line width of the (1-8)th sensing line SL1_8 most adjacentto the sensing region SA may be relatively narrow, and the line width ofthe (1-1)th sensing line SL1_1 most distant from the sensing region SAmay be relatively wide. That is, the line width of each of the firstsensing lines SL1 may be narrowed as the first sensing line SL1 becomesmore adjacent to the sensing region SA.

The line widths of the first sensing lines SL1 are designed differentfrom one another so as to allow line resistance values of the firstsensing lines SL1 to be uniform (or substantially uniform). That is, insome exemplary embodiments, the line widths of the first sensing linesSL1 are designed different from one another, so that the first sensinglines SL1 can be implemented to have the same (or substantially thesame) resistance value.

According to various exemplary embodiments, the (1-1)th sensing lineSL1_1 is located at an outermost portion of the peripheral region PA,which is most distant from the sensing region SA, and may be connectedto the first sensing electrodes SSE1 disposed on a row most distant fromthe first touch sensor pad unit TP1. On the other hand, the (1-8)thsensing line SL1_8 is located in the peripheral region PA to be mostadjacent to the sensing region SA, and may be connected to the firstsensing electrodes SSE1 on a row closest to the first touch sensor padunit TP1. Therefore, the (1-1)th sensing line SL1_1 may have a linelength longer than that of the (1-8)th sensing line SL1_8.

In general, a line resistance value is in proportion to a line length.When the (1-1)th sensing line SL1_1 and the (1-8)th sensing line SL1_8have the same line width, the line resistance value of the (1-1)thsensing line SL1_1 having a relatively long line length may be greaterthan that of the (1-8)th sensing line SL1_8 having a relatively shortline length. The difference in line resistance value between the (1-1)thsensing line SL1_1 and the (1-8)th sensing line SL1_8 may differentlydistort sensing input signals respectively applied to the (1-1)thsensing line SL1_1 and the (1-8)th sensing line SL1_8. When a uniformsensing input signal is not provided to the whole of the sensing regionSA, the touch recognition rate of the touch sensor 200 may be degraded.In order to prevent (or reduce) these differences, in some exemplaryembodiments, the widths of the first sensing lines SL1 are designeddifferent from one another, so that the line resistance values of thefirst sensing lines SL1 can be uniform, thereby improving the touchrecognition rate of the touch sensor 200.

Each of the first sensing lines SL1 may include a first contact holeCH1. For convenience, it is illustrated and described that each of thefirst sensing lines SL1 includes one first contact hole CH1, butexemplary embodiments are not limited thereto or thereby. For example,the first contact hole CH1 may be provided in plurality in acorresponding first sensing line SL1. For instance, a plurality of firstcontact holes CH1 may be spaced apart along the length and/or width of acorresponding first sensing line SL1. The first contact hole CH1 mayhave a size corresponding to the line width of a corresponding firstsensing line SL1. For example, the size of the first contact hole CH1included in the (1-1)th sensing line SL1_1 having a relatively wide linewidth may be larger than that of the first contact hole CH1 included inthe (1-8)th sensing line SL1_8 having a relatively narrow line width.The size of the first contact hole CH1 is changed to correspond to theline width of each of the first sensing lines SL1, so that contactresistances of the first sensing lines SL1 become uniform.

According to some exemplary embodiments, each of the first sensing linesSL1 may be provided as a double layer, e.g., a multi-layer structure onthe second base substrate BS2 so as to have a low resistance. Forexample, each of the first sensing lines SL1 may include a first metallayer MTL1 provided on the second base substrate BS2 and a second metallayer MTL2 connected to the first metal layer MTL1 through the firstcontact hole CH1. Here, the first metal layer MTL1 and the second metallayer MTL2 may have the same width when viewed on a plane.

As described above, the line widths of the first sensing lines SL1 aredesigned different from one another, so that the first sensing lines SL1can be implemented to have the same resistance. Further, the touchrecognition rate of the touch sensor 200 becomes uniform in the wholeregion of the touch sensor 200, so that a touch event of a user can beaccurately recognized.

Hereinafter, the first sensing lines SL1 will be described according toa stacking order with reference to FIG. 6.

Referring to FIG. 6, a first metal layer MTL1 may be provided on thesecond base substrate BS2. The first metal layer MTL1 may be made of aconductive material. The conductive material may include a metal, anyalloy thereof, a conductive polymer, a conductive metal oxide, anano-conductive material, and the like. In some exemplary embodiments,examples of the metal may be at least one of copper, silver, gold,platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium,iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium,tantalum, titanium, bismuth, antimony, lead, and the like. Examples ofthe conductive polymer may be polythiophene-based, polypyrrole-based,polyaniline-based, polyacetylene-based, and polyphenylene-basedcompounds, mixtures thereof, and the like. For instance, a PEDOT/PSScompound among the polythiophene-based compounds may be used as theconductive polymer. Examples of the conductive metal oxide may be indiumtin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO),indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), and/orthe like. In addition, examples of the nano-conductive compound may besilver nanowire (AgNW), carbon nano tube (CNT), graphene, and/or thelike.

A first insulating layer IL1 may be provided over the first metal layerMTL1. The first insulating layer IL1 may be an inorganic insulatinglayer including an inorganic material or be an organic insulating layerincluding an organic material. Examples of the inorganic material may beinorganic insulating materials including polysiloxane, silicon nitride,silicon oxide, silicon oxynitride, and/or the like. Examples of theorganic material may be organic insulating materials including apolyacryl-based compound, a polyimide-based compound, a fluorine-basedcompound, such as Teflon, a benzocyclobutene-based compound, and/or thelike.

A second metal layer MTL2 may be provided on the first insulating layerMTL1. The second metal layer MTL2 may be made of the same material asthe first metal layer MTL1. The first metal layer MTL1 and the secondmetal layer MTL2 may have the same width with the first insulating layerIL1 interposed therebetween. Here, the width d1 of the first metal layerMTL1 and the second metal layer MTL2 of the (1-1)th sensing line SL1_1may be wider than the width d2 of the first metal layer MTL1 and thesecond metal layer MTL2 of the (1-8)th sensing line SL1_8.

A second insulating layer IL2 may be provided over the second metallayer MTL2. The second insulating layer IL2 may cover the first sensinglines SL1 and allow the first sensing lines SL1 to be electricallyinsulated from each other.

The first insulating layer IL1 and the second insulating layer IL2 mayconstitute the insulating layer (see, e.g., IL of FIG. 4) of the touchsensor 200.

FIG. 7 is a graph comparing line widths and resistances of first sensinglines according to some exemplary embodiments.

In FIG. 7, R1 shows line resistance characteristics of 33 first sensinglines when the first sensing lines have the same line width, and R2shows line resistance characteristics of 33 first sensing lines SL1 whenthe first sensing lines SL1 have different line widths. In the graph ofFIG. 7, number 1 on an X-axis may mean a first sensing line disposedmost adjacent to the sensing region SA among the 33 first sensing lines.On the X axis of the graph of FIG. 7, as a number increases from number1, the number may mean a first sensing line disposed more distant fromthe sensing region SA.

Referring to FIG. 7, it can be seen that, when the first sensing linesSL1 have different line widths, the line resistance values of the firstsensing lines become more uniform.

For example, as shown in association with R1, it can be seen that theline resistance value of each of the first sensing lines increases asthe first sensing line is disposed more distant from the sensing regionSA. This is because the line length of each of the first sensing linesincreases as the first sensing line becomes more distant from thesensing region SA, and, hence, there occurs a difference in lineresistance value between the first sensing lines.

However, as shown in association with R2, it can be seen that, althougheach of the first sensing lines SL1 having different line widths isdisposed distant from the sensing region SA, the line resistance valuesof the first sensing lines SL1 become more uniform as compared with R1.This is because each of the first sensing lines SL1 is designed to havea line width that is in reverse proportion to the line length of thefirst sensing line SL1.

FIG. 8 is an enlarged plan view of portion E2 of the touch sensor ofFIG. 3 according to some exemplary embodiments. FIG. 9 is a sectionalview taken along sectional lines IV-IV′ and V-V′ of FIG. 8 according tosome exemplary embodiments.

Referring to FIGS. 3, 8, and 9, second sensing lines SL2 may be providedin the peripheral region PA of the second base substrate BS2, and extendtoward the second touch sensor pad unit TP2 along the second directionDR2 of the second base substrate BS2 from second sensing electrodesSSE2.

The second sensing lines SL2 may include (2-1)th to (2-5)th sensinglines SL2_1, SL2_2, SL2_3, SL2_4, and SL2_5. The (2-1)th to (2-5)thsensing lines SL2_1, SL2_2, SL2_3, SL2_4, and SL2_5 may have differentline widths. For example, the line width of the (2-5)th sensing lineSL2_5 most adjacent to the sensing region SA may be relatively narrow,and the line width of the (2-1)th sensing line SL2_1 may be relativelywide. That is, the line width of each of the second sensing lines SL2may become narrower as the second sensing line SL2 becomes more adjacentto the sensing region SA.

The line widths of the second sensing lines SL2 are designed differentfrom one another so as to allow line resistance values of the secondsensing lines SL2 to become uniform (or substantially uniform). That is,in some exemplary embodiments, the line widths of the second sensinglines SL2 are designed different from one another, so that the secondsensing lines SL2 can be implemented to have the same (or substantiallythe same) resistance.

Each of the second sensing lines SL2 may include a second contact holeCH2. For convenience, it is described and illustrated that each of thesecond sensing lines SL2 includes one second contact hole CH2, butexemplary embodiments are not limited thereto or thereby. For example,the second contact hole CH2 may be provided in plurality in acorresponding second sensing line SL2. For instance, a plurality ofsecond contact holes CH2 may be spaced apart along the length and/orwidth of a second sensing line SL2.

The second contact hole CH2 may have a size corresponding to the linewidth of a corresponding second sensing line SL2. For example, the sizeof the second contact hole CH2 included in the (2-1)th sensing lineSL2_1 having a relatively wide line width may be larger than that of thesecond contact hole CH2 included in the (2-5)th sensing line SL2_5having a relatively narrow line width.

Like the first sensing lines SL1, each of the second sensing lines SL2may be formed as a multi-layer structure on the second base substrateBS2 so as to have a low resistance. For example, each of the secondsensing lines SL2 may include a first metal layer MTL1 provided on thesecond base substrate BS2 and a second metal layer MTL2 connected to thefirst metal layer MTL1 through the second contact hole CH2 passingthrough a first insulating layer IL1. The first metal layer MTL1 and thesecond metal layer MTL2 may have the same width when viewed on a plane.The width dl of the first metal layer MTL1 and the second metal layerMTL2 of the (2-1)th sensing line SL2_1 may be wider than width d2 of thefirst metal layer MTL1 and the second metal layer MTL2 of the (2-5)thsensing line SL2_5.

FIG. 10 is an enlarged plan view of portion E3 of the touch sensor ofFIG. 3 according to some exemplary embodiments. FIG. 11 is a sectionalview taken along sectional line VI-VI′ of FIG. 10 according to someexemplary embodiments.

Referring to FIGS. 3, 10, and 11, the touch sensor 200 may include asecond base substrate BS2, first sensing units SR1, and second sensingunits SR2 provided on the second base substrate BS2. The first sensingunit SR1 includes a first sensing electrode SSE1 and a first bridge BR1that connects adjacent first sensing electrodes SSE1 to each other. Thesecond sensing unit SR1 includes a second sensing electrode SSE2 and asecond bridge BR2 that connects adjacent second sensing electrodes SSE2to each other.

The first sensing electrode SSE1 and the second sensing electrode SSE2may be provided on the second base substrate BS2 and may be disposed inthe same layer. In this case, the first sensing electrode SSE1 and thesecond sensing electrode SSE2 may be formed as independent patterns thatare not connected to each other. Two first sensing electrodes SSE1adjacent to each other may be connected to each other by the firstbridge BR1 disposed in the same layer as the first sensing electrodesSSE1. Two second sensing electrodes SSE2 adjacent to each other may beconnected to each other by the second bridge BR2 through third contactholes CH3 passing through the first insulating layer ILL A secondinsulating layer IL2 may be provided over the second bridge BR2 and thefirst insulating layer ILL

According to various exemplary embodiments, the display device can beemployed in various electronic devices. For example, the display deviceis applicable to televisions, notebook computers, cellular phones, smartphones, smart pads, personal media players, personal digital assistants,navigational devices, various wearable devices, such as smart watches,and the like.

According to various exemplary embodiments, it is possible to provide atouch sensor having a uniform (or substantially uniform) touchrecognition rate. Also, according to various exemplary embodiments, itis possible to provide a display device having the touch sensor capableof providing a uniform (or substantially uniform) touch recognitionrate.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of thepresented claims and various obvious modifications and equivalentarrangements.

What is claimed is:
 1. A touch sensor comprising: a substratecomprising: a sensing region; and a peripheral region at a periphery ofthe sensing region; an insulating layer on the substrate, the insulatinglayer comprising contact holes; a sensor on the substrate andoverlapping the sensing region; and sensing lines on the substrate andoverlapping the peripheral region, the sensing lines being connected tothe sensor, wherein each of the sensing lines is formed as a multilayerstructure, the multilayer structure comprising: a first electricallyconductive layer on the substrate; and a second electrically conductivelayer connected to the first electrically conductive layer via a contacthole among the contact holes, and wherein widths of the sensing linesare different from one another.
 2. The touch sensor of claim 1, whereinthe widths increase with increasing distance from the sensing region. 3.The touch sensor of claim 2, wherein sizes of the contact holescorresponding to the sensing lines increase with increasing distancefrom the sensing region.
 4. The touch sensor of claim 1, wherein aplurality of contact holes among the contact holes connect the firstelectrically conductive layer to the second electrically conductivelayer, the plurality of contact holes comprising the contact hole. 5.The touch sensor of claim 1, wherein the sensor comprises: a firstsensing structure extending along a first direction of the substrate;and a second sensing structure extending along a second direction of thesubstrate, the second direction intersecting the first direction.
 6. Thetouch sensor of claim 1, wherein, when viewed in a direction normal to asurface of the substrate, widths of the first electrically conductivelayer and the second electrically conductive layer are equivalent. 7.The touch sensor of claim 1, wherein resistance values of the sensinglines are equivalent.
 8. A display device comprising: a first basesubstrate comprising: a display region; and a non-display region at theperiphery of the display region; a thin film transistor on the firstbase substrate and overlapping the display region; a light emittingdevice connected to the thin film transistor; and a touch sensor on asurface of the first base substrate, the touch sensor being configuredto sense a position of a touch interaction, wherein the touch sensorcomprises: a second base substrate comprising: a sensing regioncorresponding to the display region; and a peripheral region at aperiphery of the sensing region; an insulating layer on the second basesubstrate, the insulating layer comprising contact holes; a sensor onthe second base substrate and overlapping the sensing region; andsensing lines on the second base substrate and overlapping theperipheral region, the sensing lines being connected to the sensor,wherein each of the sensing lines is formed as a multilayer structure,the multilayer structure comprising: a first electrically conductivelayer on the second base substrate; and a second electrically conductivelayer connected to the first electrically conductive layer via a contacthole among the contact holes, and wherein widths of the sensing linesare different from one another.
 9. The display device of claim 8,wherein the widths increase with increasing distance from the sensingregion.
 10. The display device of claim 9, wherein sizes of the contactholes corresponding to the sensing lines increase with increasingdistance from the sensing region.
 11. The display device of claim 8,wherein the light emitting device comprises: a first electrode connectedto the thin film transistor; an emitting layer on the first electrode;and a second electrode on the emitting layer.
 12. The display device ofclaim 11, wherein, in a view normal to the surface, the sensing linesoverlap a portion of the second electrode in the peripheral region. 13.The display device of claim 8, wherein the sensor comprises: a firstsensing structure extending along a first direction of the second basesubstrate; and a second sensing structure extending along a seconddirection of the second base substrate, the second directionintersecting the first direction.
 14. The display device of claim 8,wherein resistance values of the sensing lines are equivalent.
 15. Thedisplay device of claim 8, wherein a plurality of contact holes amongthe contact holes connect the first electrically conductive layer to thesecond electrically conductive layer, the plurality of contact holescomprising the contact hole.
 16. A touch sensor comprising: a substratecomprising: a sensing region; and a peripheral region outside thesensing region; a sensor on a surface of the substrate and overlappingthe sensing region; and sensing lines on the surface of the substrateand overlapping the peripheral region, the sensing lines being connectedto the sensor, wherein: each of the sensing lines is formed as amultilayer structure; in a direction normal to the surface, a width ofeach multilayer structure varies between a first width and a secondwidth different from the first width; and first widths of the sensinglines are different from one another.
 17. The touch sensor of claim 16,wherein the first widths increase with increasing distance from thesensing region.
 18. The touch sensor of claim 16, wherein: themultilayer structure comprises: a first electrically conductive layer onthe surface of the substrate; a second electrically conductive layer onthe first electrically conductive layer; and a third electricallyconductive layer between the first electrically conductive layer and thesecond electrically conductive layer; a width of the third electricallyconductive layer forms the second width; and the second width is smallerthan the first width.
 19. The touch sensor of claim 18, wherein: a widthof the first electrically conductive layer forms the first width; andwidths of the first electrically conductive layer and the secondelectrically conductive layer are equivalent.
 20. The touch sensor ofclaim 16, wherein second widths of the sensing lines are different fromone another.